Cryogenic Deflash Media
Cryogenic Deflash Media-PC are high-performance sandblasting particles made of polycarbonate monofilaments. They are widely used to remove burrs on molds, plastics, rubber, composite materials, and other products. They can be used in low-temperature and normal-temperature sandblasting operations.
Cryogenic Deflash Media
Cryogenic Deflash Media
Cryogenic Deflash Media-PC are high-performance sandblasting particles made of polycarbonate monofilaments. They are widely used to remove burrs on molds, plastics, rubber, composite materials, and other products. They can be used in low-temperature and normal-temperature sandblasting operations.
Cryogenic Deflash Media-PC are high-performance sandblasting particles made of polycarbonate monofilaments. They are widely used to remove burrs on molds, plastics, rubber, composite materials, and other products. They can be used in low-temperature and normal-temperature sandblasting operations.
Product list
| Features
| Features
- Resistant to working environments of minus 80 degrees Celsius.
- Efficient operation, significantly shortening the processing cycle.
- More suitable for workpieces with complex shapes and stubborn burrs than PA6.
- Extremely high impact strength and more durable under high-speed sandblasting.
- Uniform media size to avoid equipment wear or clogging.
- Non-toxic and dust-free, will not leave any residue.
- Use with liquid nitrogen cryo-finishing machine to save labor costs.
- Certified with ISO 9001 and ISO 14001 standards.
| • Resistant to working environments of minus 80 degrees Celsius. |
| • Efficient operation, significantly shortening the processing cycle. |
| • More suitable for workpieces with complex shapes and stubborn burrs than PA6. |
| • Extremely high impact strength and more durable under high-speed sandblasting. |
| • Uniform media size to avoid equipment wear or clogging. |
| • Non-toxic and dust-free, will not leave any residue. |
| • Use with liquid nitrogen cryo-finishing machine to save labor costs. |
| • Certified with ISO 9001 and ISO 14001 standards. |
| Cryogenic Deflash Media-PC | |||
|---|---|---|---|
| Texture of Material | Polycarbonate+antistatic | ||
| Grain Shape | Cylinder/Hexahedron | ||
| Particle Color | Translucent Milky White/Yellow/Red/Green | ||
| True Specific Gravity | 1.461–1.53 | ||
| Bulk Density | 0.93–0.96g/cm³ | ||
| Stretching Force | 750kg/cm² | ||
| Bending Stress | 1000kg/cm² | ||
| Water Absorption Rate 23℃ | 1.8 | ||
| Molding Shrinkage Rate | 1.2—1.5 | ||
| Surface Resistivity | <109 | ||
| HDT | 205℃ | ||
| Melting Point | 220℃ | ||
| Smell | Odorless | ||
| Iron Content | 0.05 | ||
| Available Sizes | |||
| Name | Inches | Millimeters | |
| length x width x diagonal | length x width x diagonal | ||
| PC-60 | .060 x .060 x .085 | 1.52 x 1.52 x 2.15 | |
| PC-45 | .045 x .045 x .063 | 1.14 x 1.14 x 1.61 | |
| PC-30 | .030 x .030 x .042 | 0.76 x 0.76 x 1.07 | |
| PC-25 | .025 x .025 x .035 | 0.625 x 0.625 x 0.875 | |
| PC-20 | .020 x .020 x .028 | 0.50 x 0.50 x 0.72 | |
| Cryogenic Deflash Media-PC | |||
|---|---|---|---|
| Texture of Material | Polycarbonate+antistatic | ||
| Grain Shape | Cylinder/Hexahedron | ||
| Particle Color | Translucent Milky White/Yellow/Red/Green | ||
| True Specific Gravity | 1.461–1.53 | ||
| Bulk Density | 0.93–0.96g/cm³ | ||
| Stretching Force | 750kg/cm² | ||
| Bending Stress | 1000kg/cm² | ||
| Water Absorption Rate 23℃ | 1.8 | ||
| Molding Shrinkage Rate | 1.2—1.5 | ||
| Surface Resistivity | <109 | ||
| HDT | 205℃ | ||
| Melting Point | 220℃ | ||
| Smell | Odorless | ||
| Iron Content | 0.05 | ||
| Available Sizes | |||
| Name | Inches | Millimeters | |
| length x width x diagonal | length x width x diagonal | ||
| PC-60 | .060 x .060 x .085 | 1.52 x 1.52 x 2.15 | |
| PC-45 | .045 x .045 x .063 | 1.14 x 1.14 x 1.61 | |
| PC-30 | .030 x .030 x .042 | 0.76 x 0.76 x 1.07 | |
| PC-25 | .025 x .025 x .035 | 0.625 x 0.625 x 0.875 | |
| PC-20 | .020 x .020 x .028 | 0.50 x 0.50 x 0.72 | |
| Applications
| Applications
- Remove burrs from circuit boards, sensors, and other parts;
- Surface cleaning and burr removal of electronic components;
- Remove burrs from lamp housings, seals, and instrument panel components;
- Deburring of spacecraft parts such as aluminum alloys and titanium alloys;
- Deburrs optical components to keep surfaces smooth.
| • Remove burrs from circuit boards, sensors, and other parts; |
| • Surface cleaning and burr removal of electronic components; |
| • Remove burrs from lamp housings, seals, and instrument panel components; |
| • Deburring of spacecraft parts such as aluminum alloys and titanium alloys; |
| • Deburrs optical components to keep surfaces smooth; |
